MTR: DSL Chips:
Market Shares, Strategies, and Forecasts, Worldwide, 2013 to 2018
Summary
According to author of the study, "Deutsche Telekom,
British Telecom, AT&T, Bell Canada, Century/Qwest and many other carriers
have made clear they will use DSL, not fiber, for the majority of lines because
it's cheaper. Increasingly, that's DSL from a neighborhood DSLAM (FTTN) with
short loops that will soon be capable of 100 megabits through bonding and
vectoring. There is plenty of copper wire in the telecommunications networks
that can be used to provide broadband connectivity from fiber in the
neighborhood, DSLAM connectivity to copper wires running into the home."
The rapid advance of end to end optical broadband networks continues to threaten to make xDSL obsolete, but copper will never go away, fiber is too expensive to use it to replace all the copper and the copper works in many cases and does not need to be replaced. xDSL markets will be strong for some long time to come as copper remains a transport line.
Copper is everywhere in the telecommunications network. It is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.
Both smart phones and tablet devices depend on wire line backhaul, much of which is copper. As copper goes away, xDSL goes away, but this is certainly not happening within the forecast period. The development and growth of the broadband digital subscriber line (DSL) and
The rapid advance of end to end optical broadband networks continues to threaten to make xDSL obsolete, but copper will never go away, fiber is too expensive to use it to replace all the copper and the copper works in many cases and does not need to be replaced. xDSL markets will be strong for some long time to come as copper remains a transport line.
Copper is everywhere in the telecommunications network. It is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.
Both smart phones and tablet devices depend on wire line backhaul, much of which is copper. As copper goes away, xDSL goes away, but this is certainly not happening within the forecast period. The development and growth of the broadband digital subscriber line (DSL) and
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communications processing markets is assured as carriers seek to
leverage their investment in copper wire infrastructure. DSL is the way to do
that with its support for high speed communications and video signal transport.
Vendors consider companies that have access to broadband or communications processing technology as potential competitors. Established competitors, suppliers of products based on new or emerging technologies, and customers who choose to develop their own technology.
Deutsche Telekom, British Telecom, AT&T, Bell Canada, Century/Qwest and many other carriers have made clear they will use DSL, not fiber, for the majority of lines because it's cheaper. Increasingly, that's DSL from a neighborhood DSLAM (FTTN) with short loops that will soon be capable of 100 megabits through bonding and vectoring.
Even the DSL customers have a hybrid fiber / copper connection; it is just the last mile that is copper, hence requiring DSL.
The communications consumer end points worldwide are moving to 100% wireless smart phones that can connect to the Internet. The communications infrastructure worldwide will remain wire based to connect the central office to the base stations, and to provide Internet / IP based connectivity to the home. The wire based communications infrastructure worldwide is all moving to fiber so as to handle the increased demand for bandwidth.
The copper is not efficient for the cable companies because of the demand for bandwidth to the home that the cable companies are providing. The copper is not efficient in the wireless backbone connectivity of the central office to the wireless base stations, and hence there is a priority on replacing the copper that is there first. The copper from the curb or from the neighborhood to toe home is efficient; therefore the need for DSL persists.
Worldwide tablet market revenues at $799 million in 2011 are anticipated to reach $1.7 billion by 2018. DSL chip markets are forecast to grow year-over-year throughout the forecast period. This is in the context of a world communications infrastructure that is changing and seeking to leverage the existing plant to hold down costs. Technology is enabling interaction, innovation, and sharing of knowledge in new ways. DSL chips promise to bring significant new broadband for Internet access capability making the Internet available for increasingly productive, efficient use.
Vendors consider companies that have access to broadband or communications processing technology as potential competitors. Established competitors, suppliers of products based on new or emerging technologies, and customers who choose to develop their own technology.
Deutsche Telekom, British Telecom, AT&T, Bell Canada, Century/Qwest and many other carriers have made clear they will use DSL, not fiber, for the majority of lines because it's cheaper. Increasingly, that's DSL from a neighborhood DSLAM (FTTN) with short loops that will soon be capable of 100 megabits through bonding and vectoring.
Even the DSL customers have a hybrid fiber / copper connection; it is just the last mile that is copper, hence requiring DSL.
The communications consumer end points worldwide are moving to 100% wireless smart phones that can connect to the Internet. The communications infrastructure worldwide will remain wire based to connect the central office to the base stations, and to provide Internet / IP based connectivity to the home. The wire based communications infrastructure worldwide is all moving to fiber so as to handle the increased demand for bandwidth.
The copper is not efficient for the cable companies because of the demand for bandwidth to the home that the cable companies are providing. The copper is not efficient in the wireless backbone connectivity of the central office to the wireless base stations, and hence there is a priority on replacing the copper that is there first. The copper from the curb or from the neighborhood to toe home is efficient; therefore the need for DSL persists.
Worldwide tablet market revenues at $799 million in 2011 are anticipated to reach $1.7 billion by 2018. DSL chip markets are forecast to grow year-over-year throughout the forecast period. This is in the context of a world communications infrastructure that is changing and seeking to leverage the existing plant to hold down costs. Technology is enabling interaction, innovation, and sharing of knowledge in new ways. DSL chips promise to bring significant new broadband for Internet access capability making the Internet available for increasingly productive, efficient use.
Table of contents
DSL Chip Market
Dynamics and Market Description
1.1 Digital Subscriber Line (DSL) Chips
1.1.1 Demand for Broadband Services and Market Opportunities for Service Providers
1.1 Digital Subscriber Line (DSL) Chips
1.1.1 Demand for Broadband Services and Market Opportunities for Service Providers
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1.1.2 High-Performance
Communications Processing
1.1.3 Key Benefits of DSL Technology
1.1.4 Improving Time-To-Market With Programmable Systems-Level Products
1.1.5 DSL Provides Cost-Effective, High-Performance Transmission Over Existing Copper Lines
1.1.6 End-to-End DSL Products
1.2 Stability Of Global Credit And Financial Markets
1.3 DSL Design Wins
1.3.1 Semiconductor Components
1.4 Communications Industry
1.4.1 Carrier Networking
1.4.2 Enterprise Networking
1.4.3 Cloud Computing
1.4.4 Increasing Demands for "Next-Generation Networking" Integrated Circuits
1.5 Communications Strategy
1.6 Internet And Wireless Dominate Communications Technology
1.6.1 Optical Networks
1.6.2 Data And Video Traffic Being Added In Abundance To Voice Traffic
1.6.3 Semiconductor Companies Design DSL
1.7 Storage Industry
1.8 Mixed Signal Integrated Circuit Market
1.8.1 Network Access Last Mile Of Telecommunications Network
1.8.2 Metropolitan Area Networks
1.8.3 Internet
1.9 Signal Processing
1.10 Product Positioning
2. DSL Chips Market Shares and Market Forecasts
2.1 DSL Chip Market Driving Forces
2.1.1 Vendor DSL Positioning
2.1.2 Data And Video Traffic Being Added To Voice Traffic In Abundance
2.2 DSL Chip Market Shares
2.2.1 Broadcom
2.2.2 Ikanos
2.2.3 Ikanos Shipments
1.1.3 Key Benefits of DSL Technology
1.1.4 Improving Time-To-Market With Programmable Systems-Level Products
1.1.5 DSL Provides Cost-Effective, High-Performance Transmission Over Existing Copper Lines
1.1.6 End-to-End DSL Products
1.2 Stability Of Global Credit And Financial Markets
1.3 DSL Design Wins
1.3.1 Semiconductor Components
1.4 Communications Industry
1.4.1 Carrier Networking
1.4.2 Enterprise Networking
1.4.3 Cloud Computing
1.4.4 Increasing Demands for "Next-Generation Networking" Integrated Circuits
1.5 Communications Strategy
1.6 Internet And Wireless Dominate Communications Technology
1.6.1 Optical Networks
1.6.2 Data And Video Traffic Being Added In Abundance To Voice Traffic
1.6.3 Semiconductor Companies Design DSL
1.7 Storage Industry
1.8 Mixed Signal Integrated Circuit Market
1.8.1 Network Access Last Mile Of Telecommunications Network
1.8.2 Metropolitan Area Networks
1.8.3 Internet
1.9 Signal Processing
1.10 Product Positioning
2. DSL Chips Market Shares and Market Forecasts
2.1 DSL Chip Market Driving Forces
2.1.1 Vendor DSL Positioning
2.1.2 Data And Video Traffic Being Added To Voice Traffic In Abundance
2.2 DSL Chip Market Shares
2.2.1 Broadcom
2.2.2 Ikanos
2.2.3 Ikanos Shipments
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2.2.4 Ikanos VDSL
2.2.5 Lantiq Broadband Solutions
2.2.6 MediaTek / Ralink / Trendchip
2.3 DSL Chip Market Forecasts
2.3.1 Digital Subscriber Line (DSL) Subscriber Markets
2.4 Research and Development
2.5 DSL Chip Applications
2.6 DSL Chip Prices
2.7 DSL Chip Regional Market
3. DSL Chips: Product Description
3.1 Broadcom
3.1.1 Broadcom BCM6519 Multi-DSL Transceiver
3.1.2 Broadcom BCM6529 Low Power Dual-Channel Analog Front End Device
3.1.3 Broadcom BCM65300 VDSL2 G.Vector Central Office SoC
3.1.4 Broadcom BCM65x00 Family Central Office High Density Multi-DSL Chipset
3.1.5 Broadcom BCM6515 High-Performance VoIP Digital Signal Processor
3.1.6 Broadcom xDSL CPE Solutions
3.1.7 BCM63168 xDSL Integrated Access Device SoC
3.1.8 BCM6338 ADSL2+ Router Solution
3.1.9 BCM6348 Single-Chip ADSL2+ CPE Chip
3.1.10 BCM6358 Single-Chip ADSL2+ Integrated Access Device Solution
3.1.11 BCM6362 Single-Chip IAD with Integrated ADSL2+, 802.11n and DECT
3.1.12 BCM6368 Residential VDSL2/ADSL2+ Gateway Solution
3.2 Lantiq
3.2.1 Lantiq XWAY™ VRX200
3.2.2 Lantiq XWAY™ VRX200
3.2.3 Lantiq XWAY™ VRX288 / VRX208
3.2.4 Lantiq XWAY™ VRX268 / VRX208
3.2.5 Lantiq XWAY™ VRX288 / VRX208
3.2.6 Lantiq CONVERGATE™
3.2.7 Lantiq MELT
3.2.8 Lantiq VINETIC™-LTC
3.2.9 Lantiq Smart SLIC™-T
2.2.5 Lantiq Broadband Solutions
2.2.6 MediaTek / Ralink / Trendchip
2.3 DSL Chip Market Forecasts
2.3.1 Digital Subscriber Line (DSL) Subscriber Markets
2.4 Research and Development
2.5 DSL Chip Applications
2.6 DSL Chip Prices
2.7 DSL Chip Regional Market
3. DSL Chips: Product Description
3.1 Broadcom
3.1.1 Broadcom BCM6519 Multi-DSL Transceiver
3.1.2 Broadcom BCM6529 Low Power Dual-Channel Analog Front End Device
3.1.3 Broadcom BCM65300 VDSL2 G.Vector Central Office SoC
3.1.4 Broadcom BCM65x00 Family Central Office High Density Multi-DSL Chipset
3.1.5 Broadcom BCM6515 High-Performance VoIP Digital Signal Processor
3.1.6 Broadcom xDSL CPE Solutions
3.1.7 BCM63168 xDSL Integrated Access Device SoC
3.1.8 BCM6338 ADSL2+ Router Solution
3.1.9 BCM6348 Single-Chip ADSL2+ CPE Chip
3.1.10 BCM6358 Single-Chip ADSL2+ Integrated Access Device Solution
3.1.11 BCM6362 Single-Chip IAD with Integrated ADSL2+, 802.11n and DECT
3.1.12 BCM6368 Residential VDSL2/ADSL2+ Gateway Solution
3.2 Lantiq
3.2.1 Lantiq XWAY™ VRX200
3.2.2 Lantiq XWAY™ VRX200
3.2.3 Lantiq XWAY™ VRX288 / VRX208
3.2.4 Lantiq XWAY™ VRX268 / VRX208
3.2.5 Lantiq XWAY™ VRX288 / VRX208
3.2.6 Lantiq CONVERGATE™
3.2.7 Lantiq MELT
3.2.8 Lantiq VINETIC™-LTC
3.2.9 Lantiq Smart SLIC™-T
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3.2.10 Lantiq XWAY™
DANUBE
3.3 Ikanos
3.3.1 Ikanos Chipsets for Central Office Equipment
3.3.2 Ikanos Chipsets for Customer Premises Equipment
3.3.3 • Ikanos Velocity™ A/VDSL CO Chipset
3.3.4 Ikanos Accelity™-2+ 8-Port VDSL2 Central Office Chipsets
3.3.5 Ikanos’ Accelity™ DA87781 VDSL2 CPE chipset
3.3.6 Ikanos Fx™-5 CO
3.3.7 Ikanos FxS™-5 CPE
3.3.8 Ikanos Maxtane™ CX955xx
3.3.9 Ikanos Orion™ Plus CX98124-11Z
3.3.10 Ikanos Fusiv Vx185/183
3.4 Analog Devices
3.5 MediaTek xDSL(Ralink) / Trendchip
4. DSL Chip Technology
4.1 Delivering Video-Intensive Services
4.2 Ikanos Technologies
4.2.1 Advanced Bonding Capabilities
4.2.2 Flexible Network Interfaces
4.3 Ikanos NodeScale™ Vectoring
4.3.1 Ikanos Quality Video (iQV) technology
4.4 Telecommunications and DSL Standards Organizations
4.4.1 ATIS
4.4.2 Broadband Forum
4.4.3 ETSI
4.4.4 FSAN
4.4.5 Home Gateway Initiative
4.4.6 The International Telecommunications Union
4.4.7 TTC
4.4.8 UNH-IOL
4.4.9 The FTTH Council Europe
4.4.10 The FTTH Council Asia-Pacific
4.4.11 The Broadband Forum
3.3 Ikanos
3.3.1 Ikanos Chipsets for Central Office Equipment
3.3.2 Ikanos Chipsets for Customer Premises Equipment
3.3.3 • Ikanos Velocity™ A/VDSL CO Chipset
3.3.4 Ikanos Accelity™-2+ 8-Port VDSL2 Central Office Chipsets
3.3.5 Ikanos’ Accelity™ DA87781 VDSL2 CPE chipset
3.3.6 Ikanos Fx™-5 CO
3.3.7 Ikanos FxS™-5 CPE
3.3.8 Ikanos Maxtane™ CX955xx
3.3.9 Ikanos Orion™ Plus CX98124-11Z
3.3.10 Ikanos Fusiv Vx185/183
3.4 Analog Devices
3.5 MediaTek xDSL(Ralink) / Trendchip
4. DSL Chip Technology
4.1 Delivering Video-Intensive Services
4.2 Ikanos Technologies
4.2.1 Advanced Bonding Capabilities
4.2.2 Flexible Network Interfaces
4.3 Ikanos NodeScale™ Vectoring
4.3.1 Ikanos Quality Video (iQV) technology
4.4 Telecommunications and DSL Standards Organizations
4.4.1 ATIS
4.4.2 Broadband Forum
4.4.3 ETSI
4.4.4 FSAN
4.4.5 Home Gateway Initiative
4.4.6 The International Telecommunications Union
4.4.7 TTC
4.4.8 UNH-IOL
4.4.9 The FTTH Council Europe
4.4.10 The FTTH Council Asia-Pacific
4.4.11 The Broadband Forum
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4.4.12 Home Gateway
Initiative
4.4.13 Communications Standards Bodies:
5 DSL Chip Company Profiles
5.1 Analog Devices
5.1.1 Analog Devices Focus On Key Strategic Markets
5.1.2 Analog Devices Broad Line Of High-Performance ICs
5.1.3 Analog Devices Digital Signal Processing Products
5.1.4 Analog Devices Revenue
5.1.5 Analog Devices Revenue Trends by End Market
5.1.6 Analog Devices Industrial –
5.1.7 Analog Devices Automotive –
5.1.8 Analog Devices Consumer –
5.1.9 Analog Devices Communications –
5.1.10 Analog Devices Markets and Applications
5.1.11 Analog Devices Industrial and Instrumentation Segments
5.1.12 Analog Devices Defense/Aerospace Segment
5.1.13 Analog Devices Energy Management Segment
5.1.14 Analog Devices Healthcare Segment
5.1.15 Analog Devices Automotive Segment
5.1.16 Analog Devices Consumer Segment
5.1.17 Analog Devices Communications Segment
5.1.18 Analog Devices Segment Financial Information and Geographic Information
5.1.19 Analog Devices Revenue Trends by Product Type
5.1.20 Analog Devices Revenue Trends by Geographic Region
5.2 Broadcom
5.2.1 Broadcom Revenue
5.2.2 Broadcom Broadband Communications Solutions
5.2.3 Broadcom Mobile & Wireless (Solutions for the Hand)
5.2.4 Broadcom Infrastructure & Networking (Solutions for Infrastructure)
5.2.5 Broadcom Customers and Strategic Relationships
5.3 BroadLight
5.4 Cavium
5.4.1 Cavium Customers and Target Markets
4.4.13 Communications Standards Bodies:
5 DSL Chip Company Profiles
5.1 Analog Devices
5.1.1 Analog Devices Focus On Key Strategic Markets
5.1.2 Analog Devices Broad Line Of High-Performance ICs
5.1.3 Analog Devices Digital Signal Processing Products
5.1.4 Analog Devices Revenue
5.1.5 Analog Devices Revenue Trends by End Market
5.1.6 Analog Devices Industrial –
5.1.7 Analog Devices Automotive –
5.1.8 Analog Devices Consumer –
5.1.9 Analog Devices Communications –
5.1.10 Analog Devices Markets and Applications
5.1.11 Analog Devices Industrial and Instrumentation Segments
5.1.12 Analog Devices Defense/Aerospace Segment
5.1.13 Analog Devices Energy Management Segment
5.1.14 Analog Devices Healthcare Segment
5.1.15 Analog Devices Automotive Segment
5.1.16 Analog Devices Consumer Segment
5.1.17 Analog Devices Communications Segment
5.1.18 Analog Devices Segment Financial Information and Geographic Information
5.1.19 Analog Devices Revenue Trends by Product Type
5.1.20 Analog Devices Revenue Trends by Geographic Region
5.2 Broadcom
5.2.1 Broadcom Revenue
5.2.2 Broadcom Broadband Communications Solutions
5.2.3 Broadcom Mobile & Wireless (Solutions for the Hand)
5.2.4 Broadcom Infrastructure & Networking (Solutions for Infrastructure)
5.2.5 Broadcom Customers and Strategic Relationships
5.3 BroadLight
5.4 Cavium
5.4.1 Cavium Customers and Target Markets
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5.5 Freescale
Semiconductor
5.5.1 Freescale Embedded Innovation
5.6 Ikanos
5.6.1 Ikanos Outsourcing and Value Chain
5.6.2 Ikanos Net Loss
5.6.3 Service Provider Platform Deployments
5.6.4 Ikanos Revenue
5.6.5 Ikanos Revenue
5.6.6 Ikanos Revenue by Country as a Percentage of Total Revenue
5.6.7 Ikanos Acquired from Conexant Systems, its Broadband Access Product Line
5.6.8 Ikanos Product Lines
5.6.9 Ikanos Solution
5.6.10 Key Features of Ikanos Technology
5.6.11 Ikanos Major Service Provider Customers
5.6.12 Ikanos Service and Support for Customers and Service Providers
5.6.13 Sales, Business Development and Product Marketing
5.6.14 Ikanos Go to Market Strategy
5.6.15 Ikanos / Aricent
5.6.16 Ikanos / ASSIA, Inc.
5.6.17 Ikanos / Atheros
5.6.18 Ikanos / DSP Group
5.6.19 Ikanos / D2 Technologies
5.6.20 Ikanos / Gatespace
5.6.21 Ikanos / Jungo
5.6.22 Ikanos / picoChip
5.6.23 Ikanos / Ralink
5.6.24 Ikanos / SoftAtHome
5.6.25 Ikanos / Sunrise Telecom
5.6.26 Ikanos / Wintegra
5.7 Infineon Technologies
5.7.1 Infineon Technologies Revenue
5.8 IXYS Integrated Circuits Division
5.8.1 IXYS Integrated Circuits Distribution Channels
5.5.1 Freescale Embedded Innovation
5.6 Ikanos
5.6.1 Ikanos Outsourcing and Value Chain
5.6.2 Ikanos Net Loss
5.6.3 Service Provider Platform Deployments
5.6.4 Ikanos Revenue
5.6.5 Ikanos Revenue
5.6.6 Ikanos Revenue by Country as a Percentage of Total Revenue
5.6.7 Ikanos Acquired from Conexant Systems, its Broadband Access Product Line
5.6.8 Ikanos Product Lines
5.6.9 Ikanos Solution
5.6.10 Key Features of Ikanos Technology
5.6.11 Ikanos Major Service Provider Customers
5.6.12 Ikanos Service and Support for Customers and Service Providers
5.6.13 Sales, Business Development and Product Marketing
5.6.14 Ikanos Go to Market Strategy
5.6.15 Ikanos / Aricent
5.6.16 Ikanos / ASSIA, Inc.
5.6.17 Ikanos / Atheros
5.6.18 Ikanos / DSP Group
5.6.19 Ikanos / D2 Technologies
5.6.20 Ikanos / Gatespace
5.6.21 Ikanos / Jungo
5.6.22 Ikanos / picoChip
5.6.23 Ikanos / Ralink
5.6.24 Ikanos / SoftAtHome
5.6.25 Ikanos / Sunrise Telecom
5.6.26 Ikanos / Wintegra
5.7 Infineon Technologies
5.7.1 Infineon Technologies Revenue
5.8 IXYS Integrated Circuits Division
5.8.1 IXYS Integrated Circuits Distribution Channels
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5.8.2 IXYS Integrated
Circuits / Clare
5.9 Lantiq
5.10 Marvell
5.11 MediaTek / Ralink Technology
5.11.1 MediaTek / Ralink / Trendchip xDSL
5.11.2 MediaTek xDSL(Ralink)
5.12 PMC-Sierra
5.13 Pulse
5.14 Shantou New Tideshine Electron
5.15 Shenzhen Chaoyue Electronics Co., Ltd.
5.16 Shenzhen Sky Foundation
5.17 Shenzhen Tianxiaowei Electronics Co., Ltd.
5.18 Other xDSL Chip Based Products and Market Participants
5.9 Lantiq
5.10 Marvell
5.11 MediaTek / Ralink Technology
5.11.1 MediaTek / Ralink / Trendchip xDSL
5.11.2 MediaTek xDSL(Ralink)
5.12 PMC-Sierra
5.13 Pulse
5.14 Shantou New Tideshine Electron
5.15 Shenzhen Chaoyue Electronics Co., Ltd.
5.16 Shenzhen Sky Foundation
5.17 Shenzhen Tianxiaowei Electronics Co., Ltd.
5.18 Other xDSL Chip Based Products and Market Participants
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